QS93 NXP i.MX 93 27x27mm surface-mounted QFN Computer On Module

	NXP i.MX93 1.5 GHz Dual Cortex^®-A55
	1GB LPDDR4, 4GB eMMC
	-40 °C to 85 °C
	27 x 27 x 2.7 mm
	Datasheet

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QS Module sind kleine, quadratische Einlöt-Computermodule mit lediglich 27 mm Kantenlänge. Die QFN ähnliche Bauform besitzt 100 Anschlüsse im 1mm Raster. Das zentrale Massepad dient neben EMV gerechter Signalführung zusätzlich auch zur Wärmeleitung.

NXP i.MX 93

i.MX 93 applications processors deliver efficient machine learning (ML) acceleration, energy flex architecture and state-of-the-art security to support energy-efficient edge computing. i.MX 93 processors offer fast and efficient ML inferencing along with a rich set of peripherals and high-performance application cores for automotive, industrial and consumer IoT market segments.

View the fact sheet

Assembly of QS-Modules

QS93 at a glance

Main CPU	2 x Cortex^®-A55, 1.5 GHz
MCU	Cortex^®-M33, 250MHz
Memory	1GB LPDDR4 2MB NOR Flash 4GB eMMC
Graphics	Hardware Compositor for Blending/Composition, Resize, Color Space Conversion
Security	NXP’s EdgeLock^® secure enclave
Display	LVDS
Expansion I/O	2x USB with PHY
Network/Storage	2x Gb Ethernet RGMII 2x CAN SD/eMMC
IO	5x UART 7x I2C 4x SPI

Processor features

Automotive: domain controller compute off-load engine, driver monitoring system, audio, speech recognition, cost-effective gateway
Industrial Automation: gateways, remote I/O controllers,industrial scanners, HMI, machine vision
Building Control and Energy: energy meters, EV charging
Smart Home: home security hub, smart doorbell, smart lock, smart thermostat, AV receivers
Smart City: smart lighting, safety and security, traffic control

For more information regarding i.MX 8 processors, see the NXP product page.

Solder-down SoM

Solder-Down
System-on-Module
Simplifies Design & Production

A SoM, one step above an SoC, incorporates connectivity, multimedia and display, GPIO, operating system, and others in a single module. Although the industry has been traditionally using SODIMM modules (such as push-connector modules, small outline dual in-line memory module), soldered SoM modules are rapidly gaining ground. Solder modules are less expensive than their SODIMM counterparts because they are easier to manage, test in production, and allow for better economies of scale.

SoM-based designs are usually scalable to achieve a fully customized electronics assembly in terms of interfaces and form factors. SoMs can be replaced or upgraded within a carrier board. Some advantages of the SoM approach over an SoC development include cost savings, reduced market risk, reduced customer design requirements, and footprint. The only limitation with an SoM, when compared to the ground-up SoC design, is that there are fewer pins in an SoM.

Read more in our QS-Standard pinout, description and layout guidelines.

Development Kits

QSBASE93 Evalkit

Linux is pre-installed and ready for application development. Other features include:

QS module:
QS93-5210
Dual 10/100 Ethernet
LVDS Display Connector
MIPI CSI Camera Connector
USB
4-layer PCB

Part number: QS93-SV01

Download Datasheet

Varianten

Eine Übersicht der aktuellen Standardvarianten.

Kundenspezifische Versionen auf Anfrage.

Part Number	QS93-5210
Part Name	QS93/52C/1GS/4GF/I
Processor	NXP i.MX9352
SDRAM	1 GiB
Flash	4 GB
Display-IF	LVDS
Temperature	-40 °C to 85 °C

Deklarationen

REACH Declaration

Long-term Supplier's Declaration

RoHS Declaration

Dokumentation

Ka-Ro Docs - docs.karo-electronics.de

In unserer offiziellen Dokumentation auf GitHub helfen wir Ihnen einen einfachen Einstieg in die Nutzung unserer Produkte zu erlangen.
Hier finden Sie auch weitreichende Informationen über unsere Hardware und die Erstellung Ihrer eigenen Lösung.

Kundenbereich

Kunden stehen im Downloadbereich weitere Unterlagen wie 3D-Daten, Schaltpläne, Designdaten und Datenblätter zur Verfügung.

Customer Area File History

Software

Ka-Ro @ GitHub

Auf GitHub wird die komplette Software verwaltet.

Yocto BSPs U-Boot Linux

Vorkompilierte Images im Kundenbereich

Im Kundenbereich befinden sich auch fertige Linux und Debian Images.

Linux

Long Term Linux Kernel 5.15 Support

Ka-Ro Guides

Yocto

Yocto Gatesgarth and Hardknott Support

Ka-Ro Yocto Guide

Debian

Debian 11 (“bullseye”) Support

Ka-Ro Debian Guide

Machine Learning

Neural networks on embedded devices

Ka-Ro Machine Learning Guide

Electron

Build cross-platform desktop apps

Ka-Ro Electron Documentation

Qt5 Cross-Platform Framework

Ka-Ro Qt5 Documentation

Visual Studio Code

Cross-Compile and Debug your C apps

Ka-Ro VS Code Documentation

QS-Standard

Benefit by using QS module family

The QS module family has very compact dimensions. They include a complete embedded System on Module with processor, PMIC, RAM and flash memory.

Because of the very dense packaging on the top side, there are no components on the bottom side of the module, cut-outs on the base board not required. The pin compatible family concept provides all important interfaces needed for embedded designs, e.g., USB, Gigabit-Ethernet, display and many serial interfaces.

Flexibility, high performance and easy integration

All signal connections located at the module edges, allowing easy optical inspection during production. The modules can be assembled by automatic pick & place machines without any mechanical assembly work necessary.

The pin-optimized QS concept enables the use of a simple, cost-effective 2-layer base board.

A development kit with schematics and bill of materials is available to support a quick evaluation and project start.

QSX vs. QS

QSX is a QS module enlarged by 1 mm all around.
The size hereby increased from 27 mm square to 29 mm square.
In each corner this gives additional space for a total of 8 further pads which are used for PCIe and USB3.
The inner 27 mm x 27 mm QS area remains identical, providing full compatibility.

Produktvergleich

TX	QS	Silicon Vendor	SOC	Core	#	Clock	Grade	L2-Cache	I-Cache	D-Cache	Emb. SRAM	NEON	VFP
TX93	QS93	NXP	i.MX 93	Cortex^®-A55 Cortex^®-M33	2 1	1.5 GHz 250 MHz	Ind.	64 KB	32 KB	32 KB	640 KB	√	√
TXRZ	QSRZ	RENESAS	RZ/G2L	Cortex^®-A55 Cortex^®-M33	2 1	1.2 GHz 200 MHz	Ind.	256 KB (L3)	32 KB	32 KB	128 KB	√	√
TX8P	QSXP	NXP	i.MX8M Plus	Cortex^®-A53	4	1.6 GHz	Ind.	512 KB	32 KB	32 KB	256 KB	√	√
TX8M	QS8M \| QSXM	NXP	i.MX8M Mini	Cortex^®-A53 Cortex^®-M7	4 1	1.6 GHz 750 MHz	Ind.	512 KB	32 KB	32 KB	256 KB	√	√
TX8M	QS8M	NXP	i.MX8M Nano	Cortex^®-A53	2	1.4 GHz	Ind.	512 KB	32 KB	32 KB	256 KB	√	√
TX6QP		NXP	i.MX6QuadPlus	Cortex^®-A9	4	800 MHz	Ind.	1 MB	32 KB	32 KB	256 KB	√	-
TX6Q		NXP	i.MX6Quad	Cortex^®-A9	4	1 GHz	Com.	1 MB	32 KB	32 KB	256 KB	√	-
TX6DL		NXP	i.MX6DualLite	Cortex^®-A9	2	800 MHz	Ind.	512 KB	32 KB	32 KB	128 KB	√	-
TX6S		NXP	i.MX6Solo	Cortex^®-A9	1	800 MHz	Ind.	512 KB	32 KB	32 KB	128 KB	√	-
TX6UL		NXP	i.MX6UltraLite	Cortex^®-A7	1	528 MHz	Ind.	128 KB	32 KB	32 KB	128 KB	√	-
TXMP	QSMP	STMicroelectronics	STM32MP1	Cortex^®-A7 Cortex^®-M4	1-2 1	650 MHz 209 MHz	Ind.	256 KB	32 KB	32 KB	708 KB	√	√

TX	QS	NPU	ISP	Graphics Acceleration	Video Codec	Camera Interface	LCD Interface
TX93	QS93	√	-	√ (Blending/Composition, Resize, Color Space Conversion)	-	√	LVDS
TXRZ	QSRZ	-	-	√	√	√ (TXRZ) / - (QSRZ)	24bit and MIPI
TX8P		√	√	√	√	√	LVDS + MIPI + HDMI
	QSXP	√	√	√	√	√	MIPI
TX8M	QS8M \| QSXM	-	-	√	√ (8M Mini) / - (8M Nano)	√	MIPI
TX8M		-	-	√	√	√	LVDS
TX6		-	-	√	√	√	24bit or LVDS
TXUL		-	-	-	-	√	24bit
	QSMP	-	-	-	-	√	24bit
TXMP	QSMP	-	-	√	-	√	24bit and MIPI

TX	QS	RAM Size	RAM Type	RAM width	ROM Size	ROM Type
TX93	QS93	1 GB	LPDDR4	16 bit	4 GB	eMMC
TXRZ	QSRZ	512MB / 1 GB	DDR3L-1333	16 bit	4 GB	eMMC
TX8P	QSXP	2 GB	LPDDR4	32 bit	8 GB	eMMC
	QSXM	2 GB	LPDDR4	32 bit	4 GB	eMMC
TX8M - MINI		1 GB / 2 GB	DDR3-1600	32 bit	4 GB	eMMC
TX8M - NANO		512 MB	DDR3-1600	16 bit	4 GB	eMMC
	QS8M	512MB / 1 GB	DDR3-1600	16 bit	4 GB	eMMC
TX6QP		2 GB	DDR3-1066	64 bit	4 GB	eMMC
TX6Q		1 GB	DDR3-1066	64 bit	128 MB / 8 GB	SLC NAND / eMMC
TX6DL		1 GB	DDR3-800	64 bit	128 MB / 4 GB	SLC NAND / eMMC
TX6S		256 MB / 512 MB	DDR3-800	16 bit / 32 bit	128 MB / 4 GB	SLC NAND / eMMC
TX6UL		256 MB	DDR3-800	16 bit	128 MB / 4 GB	SLC NAND / eMMC
TXMP	QSMP	256 MB / 512 MB	DDR3-1066	16 bit	128 MB / 4 GB	SLC NAND / eMMC

	USB	Ethernet	UART	I2C	SPI	SD / MMC	Serial Audio	CAN	SATA	External Memory Interface
TX93	2	2	8	√	√	1	2	2	-	-
QS93	2	2	5	√	√	1	1	2	-	-
TXRZ	2	2	7	√	√	1	2	2	-	-
QSRZ	2	1	4	√	√	1	1	2	-	-
TX8P	2	2	4	√	√	2	4	2	-	PCIe
TX8M	2 / 1	1	4	√	√	2	4	-	-	PCIe
QS8M	2 / 1	1	4	√	√	1	1	-	-	-
QSXM	2	1	4	√	√	1	1	-	-	PCIe
QSXP	2	1	4	√	√	1	1	2	-	PCIe
TX6QP	2	1	5	√	√	2	2	2	√	16 bit / PCIe
TX6Q	2	1	5	√	√	2	2	2	√	16 bit / PCIe
TX6DL	2	1	5	√	√	2	2	2	-	16 bit / PCIe
TX6S	2	1	5	√	√	2	2	2	-	16 bit / PCIe
TX6UL	2	2	8	√	√	2	1	2	-	-
TXMP	2	1	8	√	√	1	1	2	-	-
QSMP	2	1	7	√	√	1	1	2	-	-

	Linux	Windows Embedded Compact 7	Windows Embedded Compact 2013	Windows 10 IoT
TX93 \| QS93	√	-	-	-
TXRZ \| QSRZ	√	-	-	-
TX8P \| QSXP	√	-	-	-
TX8M \| QS8M \| QSXM	√	-	-	√
TX6QP	√	-	-	-
TX6Q	√	√	√	-
TX6DL	√	√	√	-
TX6S	√	√	√	-
TX6UL	√	√	-	-
TXMP \| QSMP	√	-	-	-

	Supply Voltage	U-Boot [mW]	Linux [mW]	Sleep [mW]
TX93-5210	5V / 3.3V	1110 / 1025	725 / 655	150 / 125
QSRZ-G2L0	3.3V	782	657	500 ^[1]
TXRZ-G2L0	5V / 3.3V	1040 / 941	960/ 871	985 / 900 ^[1]
TX8P-ML81	5V / 3.3V	1900 / 1800	1685/ 1600	115 / 100
TX8M-1610	5V / 3.3V	1110 / 1110	900 / 880	130 / 120
TX8M-1620	5V / 3.3V	1275 / 1277	1055 / 1059	260 / 244
TX8M-ND00	5V / 3.3V	860 / 845	670 / 650	85 / 80
TX6Q-8037	5V	2400	850	180
TX6Q-1030	5V / 3.3V	2125 / 2015	800 / 760	80 / 80
TX6U-8033	5V / 3.3V	1925 / 1840	800 / 760	80 / 80
TX6S-8034	5V / 3.3V	1425 / 1310	550 / 530	80 / 80
TXUL-5010	5V / 3.3V	710 / 620	550 / 460	29 / 28
TXUL-5011	5V / 3.3V	760 / 650	550 / 460	29 / 22
TXUL-8013	5V / 3.3V	775 / 675	365 / 340	100 / 76
TXMP-1570	5V / 3.3V	875 / 775	800 / 695	60 / 45
QSMP-1570	3.3V	660	560	20
QSMP-1530	3.3V	620	520	15
QS8M-MQ00	3.3V	840	510	60
QS8M-ND00	3.3V	670	500	45
QSXM-MM60	3.3V	1161	739	40
QSXP-ML81	3.3V	1520	1230	86

^[1] Renesas RZ/G2L has no different power domains, voltages cannot be switched off and DRAM self-refresh is not supported.

	glmark2 score	CoreMark	DhryStone	Whetstone [MIPS]	Memcpy [MB/s]	Memset [MB/s]	STREAM copy [MB/s]	STREAM scale [MB/s]	STREAM add [MB/s]	STREAM triad [MB/s]
TX93-5210	-	12762	9330534	32258	2657	4725	5738	3307	4230	4239
QSMP-1570	74	3788	2199518	10204	620	1437	1345	794	705	584
QS8M-ND00	192	9222	6922571	24390	372	1228	808	814	710	677
TXRZ-G2L0	212	8853	6850488	22727	1095	2322	2358	2286	2363	2377
QS8M-MQ00	280	21075	7912644	27777	1132	2830	2570	2647	2341	2004
QSXM-MM60	361	21028	7912644	27777	1885	8533	4243	2950	2716	2301
QSXP-ML81	863	21104	7912957	27777	2008	10690	4673	2910	2617	2216

	W	L	T
TX6	31mm (1.2'')	67.6mm (2.7")	4mm (0.16")
TX8M-LVDS	28mm (1.1")	67.6mm (2.7")	4mm (0.16")
TX93 \| TXUL \| TXMP \| TX8M-MIPI \| TX8P \| TXRZ	26mm (1.0")	67.6mm (2.7")	4mm (0.16")
QS93 \| QSMP \| QS8M \| QSRZ	27mm (1.05")	27mm (1.05")	2.3mm (0.09")
QSXM \| QSXP	29mm (1.14")	29mm (1.14")	2.3mm (0.1")

QS93

Solder-Down System-on-Module

NXP i.MX93 1.5 GHz Dual Cortex^®-A55

1GB LPDDR4, 4GB eMMC

-40 °C to 85 °C

27 x 27 x 2.7 mm

Datasheet