NXP i.MX93 1.5 GHz Dual Cortex®-A55
1GB LPDDR4, 4GB eMMC
-40 °C to 85 °C
27 x 27 x 2.7 mm
QS Module sind kleine, quadratische Einlöt-Computermodule mit lediglich 27 mm Kantenlänge. Die QFN ähnliche Bauform besitzt 100 Anschlüsse im 1mm Raster. Das zentrale Massepad dient neben EMV gerechter Signalführung zusätzlich auch zur Wärmeleitung.
NXP i.MX 93
i.MX 93 applications processors deliver efficient machine learning (ML) acceleration, energy flex architecture and state-of-the-art security to support energy-efficient edge computing. i.MX 93 processors offer fast and efficient ML inferencing along with a rich set of peripherals and high-performance application cores for automotive, industrial and consumer IoT market segments.
Assembly of QS-Modules
2 x Cortex®-A55, 1.5 GHz
|2D graphics processing|
|NXP’s EdgeLock® secure enclave|
2x USB with PHY
2x Gb Ethernet RGMII
- Automotive: domain controller compute off-load engine, driver monitoring system, audio, speech recognition, cost-effective gateway
- Industrial Automation: gateways, remote I/O controllers,industrial scanners, HMI, machine vision
- Building Control and Energy: energy meters, EV charging
- Smart Home: home security hub, smart doorbell, smart lock, smart thermostat, AV receivers
- Smart City: smart lighting, safety and security, traffic control
For more information regarding i.MX 8 processors, see the NXP product page.
Simplifies Design & Production
A SoM, one step above an SoC, incorporates connectivity, multimedia and display, GPIO, operating system, and others in a single module. Although the industry has been traditionally using SODIMM modules (such as push-connector modules, small outline dual in-line memory module), soldered SoM modules are rapidly gaining ground. Solder modules are less expensive than their SODIMM counterparts because they are easier to manage, test in production, and allow for better economies of scale.
SoM-based designs are usually scalable to achieve a fully customized electronics assembly in terms of interfaces and form factors. SoMs can be replaced or upgraded within a carrier board. Some advantages of the SoM approach over an SoC development include cost savings, reduced market risk, reduced customer design requirements, and footprint. The only limitation with an SoM, when compared to the ground-up SoC design, is that there are fewer pins in an SoM.
Read more in our QS-Standard pinout, description and layout guidelines.
Linux is pre-installed and ready for application development. Other features include:
- QS module:
- Dual Gb Ethernet
- LVDS Display Connector
- MIPI CSI Camera Connector
- 4-layer PCB
Part number: QS93-SV01
Eine Übersicht der aktuellen Standardvarianten.
Kundenspezifische Versionen auf Anfrage.
|Temperature||-40 °C to 85 °C|
In unserer offiziellen Dokumentation auf GitHub helfen wir Ihnen einen einfachen Einstieg in die Nutzung unserer Produkte zu erlangen.
Hier finden Sie auch weitreichende Informationen über unsere Hardware und die Erstellung Ihrer eigenen Lösung.
Customer Area File History
Long Term Linux Kernel 5.15 Support
Yocto Gatesgarth and Hardknott Support
Debian 11 (“bullseye”) Support
Neural networks on embedded devices
Build cross-platform desktop apps
Qt5 Cross-Platform Framework
Cross-Compile and Debug your C apps
Benefit by using QS module family
The QS module family has very compact dimensions. They include a complete embedded System on Module with processor, PMIC, RAM and flash memory.
Because of the very dense packaging on the top side, there are no components on the bottom side of the module, cut-outs on the base board not required. The pin compatible family concept provides all important interfaces needed for embedded designs, e.g., USB, Gigabit-Ethernet, display and many serial interfaces.
Flexibility, high performance and easy integration
All signal connections located at the module edges, allowing easy optical inspection during production. The modules can be assembled by automatic pick & place machines without any mechanical assembly work necessary.
The pin-optimized QS concept enables the use of a simple, cost-effective 2-layer base board.
A development kit with schematics and bill of materials is available to support a quick evaluation and project start.
QSX vs. QS
- QSX is a QS module enlarged by 1 mm all around.
- The size hereby increased from 27 mm square to 29 mm square.
- In each corner this gives additional space for a total of 8 further pads which are used for PCIe and USB3.
- The inner 27 mm x 27 mm QS area remains identical, providing full compatibility.