RENESAS RZ/G2L 1.2 GHz Dual Cortex®-A55
512MB/1GB DDR3L, 4GB eMMC
-40 °C to 85 °C
27 x 27 x 2.7 mm
QS Module sind kleine, quadratische Einlöt-Computermodule mit lediglich 27 mm Kantenlänge. Die QFN ähnliche Bauform besitzt 100 Anschlüsse im 1mm Raster. Das zentrale Massepad dient neben EMV gerechter Signalführung zusätzlich auch zur Wärmeleitung.
Renesas RZ/G2 and RZ/V2 microprocessors are the only embedded MPUs that meet the long-term support demands for industrial and infrastructure equipment manufacturers through the 10+ year support offered by the Super Long Term Support (SLTS) kernel maintained by the Civil Infrastructure Platform (CIP). The CIP SLTS Linux kernel supports countermeasures against vulnerability to security attacks with a long-term maintenance period of 10 years or more.
Assembly of QS-Modules
2 x Cortex-A55, 1.2 GHz
|Secure Boot, True RNG,|
Crypto Engine, JTAG Disable,
Device Unique ID
RGB 24, MIPI DSI (2-lanes)
2x USB with PHY
Gb Ethernet RGMII
5x UART, 4x I2C,
- High Performance
64-bit Arm Cortex-A cores, plus powerful 3D graphics engine and video engine capable of supporting up to 4K UHD, to offer the highest performance
- Wide Coverage
Entry-level RZ/G2L Group 3 products equipped with Cortex-A55 with improved processing performance have been newly added to the RZ/G2 lineup
- High Reliability
Built-in Error Correction Code (ECC) for internal and external memory, which is essential for high-reliability mission critical systems
- Super Long Term Support (SLTS)
Applying Civil Infrastructure Platform (CIP) Linux, the Linux kernel will be provided with over 10 years of support
- Verified Linux Package
Renesas verifies and provides a Linux package that combines CIP and Linux basic software. Minimize your Linux maintenance resources
For more information regarding RZ/G2L processors, see the Renesas product page.
Simplifies Design & Production
A SoM, one step above an SoC, incorporates connectivity, multimedia and display, GPIO, operating system, and others in a single module. Although the industry has been traditionally using SODIMM modules (such as push-connector modules, small outline dual in-line memory module), soldered SoM modules are rapidly gaining ground. Solder modules are less expensive than their SODIMM counterparts because they are easier to manage, test in production, and allow for better economies of scale.
SoM-based designs are usually scalable to achieve a fully customized electronics assembly in terms of interfaces and form factors. SoMs can be replaced or upgraded within a carrier board. Some advantages of the SoM approach over an SoC development include cost savings, reduced market risk, reduced customer design requirements, and footprint. The only limitation with an SoM, when compared to the ground-up SoC design, is that there are fewer pins in an SoM.
Read more in our QS-Standard pinout, description and layout guidelines.
Linux pre-installed and ready for application development. Other features include:
- QS module on sockets
- Gb Ethernet
- MIPI Display Connector
- Two port USB hub, type A connectors
- USB client & power supply, type C connector
- USB to UART bridge, micro-B connector
- 4-layer PCB
Part number: QS00-SV04
QSBASE4 on Raspberry Pi Touchscreen
The QSBASE4 EvalKit can be mounted directly to the official Raspberry Pi 7 inch Touch screen.
- Touch Display works out of the Box.
- Sources available in our Yocto Layer.
Eine Übersicht der aktuellen Standardvarianten.
Kundenspezifische Versionen auf Anfrage.
|Processor||RENESAS RZ/G2L||RENESAS RZ/G2L|
|SDRAM||1 GiB||512 MiB|
|Flash||4 GB||4 GB|
|Display-IF||RGB24, MIPI||RGB24, MIPI|
|Temperature||-40 °C to 85 °C||-40 °C to 85 °C|
In unserer offiziellen Dokumentation auf GitHub helfen wir Ihnen einen einfachen Einstieg in die Nutzung unserer Produkte zu erlangen.
Hier finden Sie auch weitreichende Informationen über unsere Hardware und die Erstellung Ihrer eigenen Lösung.
Customer Area File History
Long Term Linux Kernel 5.10 Support
Yocto Gatesgarth and Hardknott Support
Debian 11 (“bullseye”) Support
Neural networks on embedded devices
Build cross-platform desktop apps
Qt5 Cross-Platform Framework
Cross-Compile and Debug your C apps
Benefit by using QS module family
The QS module family has very compact dimensions. They include a complete embedded System on Module with processor, PMIC, RAM and flash memory.
Because of the very dense packaging on the top side, there are no components on the bottom side of the module, cut-outs on the base board not required. The pin compatible family concept provides all important interfaces needed for embedded designs, e.g., USB, Gigabit-Ethernet, display and many serial interfaces.
Flexibility, high performance and easy integration
All signal connections located at the module edges, allowing easy optical inspection during production. The modules can be assembled by automatic pick & place machines without any mechanical assembly work necessary.
The pin-optimized QS concept enables the use of a simple, cost-effective 2-layer base board.
A development kit with schematics and bill of materials is available to support a quick evaluation and project start.
QSX vs. QS
- QSX is a QS module enlarged by 1 mm all around.
- The size hereby increased from 27 mm square to 29 mm square.
- In each corner this gives additional space for a total of 8 further pads which are used for PCIe and USB3.
- The inner 27 mm x 27 mm QS area remains identical, providing full compatibility.