QSMP-23

STM32MP2 microprocessor
with dual Arm^® Cortex^®-A35
and Cortex^®-M33 Cores.

The STM32MP2 series is an industrial-grade 64-bit solution for secure Industry 4.0 and advanced edge computing applications that require high-end multimedia capabilities. Reaching up to 6,000 DMIPS, they support the growth of smart, connected applications thanks to robust features and a significant performance upgrade compared to previous generations.

Solder-Down
System-on-Module
Simplifies Design & Production
 

A SoM, one step above an SoC, incorporates connectivity, multimedia and display, GPIO, operating system, and others in a single module. Although the industry has been traditionally using SODIMM modules (such as push-connector modules, small outline dual in-line memory module), soldered SoM modules are rapidly gaining ground.  Solder modules are less expensive than their SODIMM counterparts because they are easier to manage, test in production, and allow for better economies of scale.

SoM-based designs are usually scalable to achieve a fully customized electronics assembly in terms of interfaces and form factors. SoMs can be replaced or upgraded within a carrier board. Some advantages of the SoM approach over an SoC development include cost savings, reduced market risk, reduced customer design requirements, and footprint.  The only limitation with an SoM, when compared to the ground-up SoC design, is that there are fewer pins in an SoM.