256/512MB DDR3L, 4GB eMMC or 128MB SLC NAND
-25°C to 85°C (eMMC) / -40°C to 85°C (NAND)
27 x 27 x 2.3 mm
QS Module sind kleine, quadratische Einlöt-Computermodule mit lediglich 27 mm Kantenlänge. Die QFN ähnliche Bauform besitzt 100 Anschlüsse im 1mm Raster. Das zentrale Massepad dient neben EMV gerechter Signalführung zusätzlich auch zur Wärmeleitung.
STM32MP1 Series Processors
Multicore STM32MP1 architecture is ideal for Open Source Linux based applications with real-time and power constrained subsystems
QSMP module running Electron framework
2x Cortex-A7, 650MHz
|Secure boot, TrustZone® peripherals, active tamper, Cortex®-M4 resources isolation|
2x USB with PHY
4x UART, 4x I2C,
with dual Arm® Cortex®-A7
and Cortex®-M4 Cores.
A general-purpose microprocessor portfolio enabling easy development for a broad range of applications, the STM32MP1 series is based on a heterogeneous single or dual Arm Cortex-A7 and Cortex-M4 cores architecture, strengthening its ability to support multiple and flexible applications, achieving the best performance and power figures at any time. The Cortex-A7 core provides access to open-source operating systems (Linux/Android) while the Cortex-M4 core leverages the STM32 MCU ecosystem.
For more information regarding STM32MP157 processor, see the ST product page.
Simplifies Design & Production
A SoM, one step above an SoC, incorporates connectivity, multimedia and display, GPIO, operating system, and others in a single module. Although the industry has been traditionally using SODIMM modules (such as push-connector modules, small outline dual in-line memory module), soldered SoM modules are rapidly gaining ground. Solder modules are less expensive than their SODIMM counterparts because they are easier to manage, test in production, and allow for better economies of scale.
SoM-based designs are usually scalable to achieve a fully customized electronics assembly in terms of interfaces and form factors. SoMs can be replaced or upgraded within a carrier board. Some advantages of the SoM approach over an SoC development include cost savings, reduced market risk, reduced customer design requirements, and footprint. The only limitation with an SoM, when compared to the ground-up SoC design, is that there are fewer pins in an SoM.
Read more in our QS-Standard pinout, description and layout guidelines.
Solder modules can be used just like any other component
Hardware and software integration of the newest 64-bit ARM-processor is becoming increasingly more sophisticated. Integrating everything on a single board can create some engineering challenges. Once a fully custom SoC-based board is built, it can’t be modified without delay and expense. That’s why it’s vital to know what its destination is before you design it. Despite this precaution, porting Linux or another OS to the custom hardware is an onerous task. To overcome this limitation, a SoM offers much more flexibility as the porting is already done. To further reduce costs, most projects are turning to module-based systems to increase time available for application development, reduce complexity and allow designers to focus on their core competencies.
Solder modules can be used just like any other component, and do not need to be handled and inserted manually like a SODIMM. With increasing demands on miniaturization, a SODIMM module requires more space and this can be important. The smallest soldered modules are only 27mm2 (1.1″) and this is the smallest space on which it is physically possible to mount the basic components.
In all types of designs, the connector has its cost. Even a SODIMM200 connector can cost a couple of dollars and push-fit connectors can cost a lot more. Soldering offers considerable strength and therefore the components are less vulnerable to shock and vibration.
The solder-down module’s integral ground plane provides a defined return path, avoiding ground loops and allowing efficient routing of tracks with low EMI. High-speed differential signals can be easily routed on a single layer. The ground plane also aids heat transmission to the baseboard, reducing the need for heat sinks.
In projects with BGA solutions, designers might face various problems. BGAs are very good for density, but they need high precision and it can only be inspected by through x-ray. SoMs in contact with the edges prove to be a better solution as it is possible to visually inspect the connections.
All modules will be shipped with a pre-programmed bootloader by default. To speed up the production process, the modules can also be pre-programmed to customer specifications. JEDEC version 5.0 introduces “Production State Awareness” to help avoid possible data corruption during soldering. Only a predefined part of the whole device’s available space can be supported by this feature.
QSMP QSBASE1 Evalkit
Linux is pre-installed and ready for application development. Other features include:
- QS module:
- Gb Ethernet
- RGB Display Connector
- 2-layer PCB
Part number: QSMP-SV57
Linux pre-installed and ready for application development. Other features include:
- QS module on sockets
- Gb Ethernet
- MIPI Display Connector
- Two port USB hub, type A connectors
- USB client & power supply, type C connector
- USB to UART bridge, micro-B connector
- 4-layer PCB
Part number: QS00-SV04
QSBASE4 on Raspberry Pi Touchscreen
The QSBASE4 EvalKit can be mounted directly to the official Raspberry Pi 7 inch Touch screen.
- Touch Display works out of the Box.
- Sources available in our Yocto Layer.
Eine Übersicht der aktuellen Standardvarianten.
Kundenspezifische Versionen auf Anfrage.
|SDRAM||512 MiB||256 MiB||256 MiB|
|Flash||4 GB eMMC||4 GB eMMC||128 MB SLC NAND|
|Display-IF||24-bit RGB + 2-lane MIPI-DSI||24-bit RGB + 2-lane MIPI-DSI||24-bit RGB|
|Temperature||-25 °C to 85 °C||-25 °C to 85 °C||-40 °C to 85 °C|
In unserer offiziellen Dokumentation auf GitHub helfen wir Ihnen einen einfachen Einstieg in die Nutzung unserer Produkte zu erlangen.
Hier finden Sie auch weitreichende Informationen über unsere Hardware und die Erstellung Ihrer eigenen Lösung.
Customer Area File History
Long Term Linux Kernel 5.15 Support
Yocto Gatesgarth and Hardknott Support
Debian 11 (“bullseye”) Support
Neural networks on embedded devices
Build cross-platform desktop apps
Qt5 Cross-Platform Framework
Cross-Compile and Debug your C apps
Benefit by using QS module family
The QS module family has very compact dimensions. They include a complete embedded System on Module with processor, PMIC, RAM and flash memory.
Because of the very dense packaging on the top side, there are no components on the bottom side of the module, cut-outs on the base board not required. The pin compatible family concept provides all important interfaces needed for embedded designs, e.g., USB, Gigabit-Ethernet, display and many serial interfaces.
Flexibility, high performance and easy integration
All signal connections located at the module edges, allowing easy optical inspection during production. The modules can be assembled by automatic pick & place machines without any mechanical assembly work necessary.
The pin-optimized QS concept enables the use of a simple, cost-effective 2-layer base board.
A development kit with schematics and bill of materials is available to support a quick evaluation and project start.
QSX vs. QS
- QSX is a QS module enlarged by 1 mm all around.
- The size hereby increased from 27 mm square to 29 mm square.
- In each corner this gives additional space for a total of 8 further pads which are used for PCIe and USB3.
- The inner 27 mm x 27 mm QS area remains identical, providing full compatibility.